Industry
Samsung Electronics and Broadcom Sign $200 Billion MOU Focusing on HBM and 2nm Process
Samsung Electronics and Broadcom signed a memorandum of understanding at the AI Summit, with the scale of cooperation in memory and foundry sectors expected to exceed $200 billion by 2030. The collaboration includes providing HBM and other memory solutions for Broadcom's next-generation AI accelerators, as well as Samsung offering 2nm and below process technology for Broadcom's wireless broadband communication products, extending to 2.3D/2.5D advanced packaging based on 2nm.
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