Industry
SK Hynix Recruiting DRAM-Logic 3D Stacking Tech Talent in the US, Targeting On-Device AI Market
SK Hynix is recruiting technical talent in the field of DRAM-logic 3D stacking through its US subsidiary in San Jose, aiming to lead the co-design of 3D stacked DRAM logic chips in collaboration with US customers. This technology vertically stacks DRAM dies with logic dies to establish more short-distance I/O connections, thereby increasing bandwidth, reducing latency, and improving energy efficiency to meet the inference demands of large on-device AI models.
Read the original (opens in a new tab)
News stream data aggregated by AI HOT