Product
Suiyuan Technology and Xianfeng Technology Jointly Release China's First Glass-Based CoPoS Advanced Packaging Sample for AI Computing Chips
Suiyuan Technology and Xianfeng Technology jointly released China's first glass-based CoPoS advanced packaging sample for AI computing chips at WAIC 2026. The sample integrates various materials and process technologies such as glass substrates, panel-level photolithography patterning, precision electroplating build-up, and panel-level RDL. It is the first solution combining Suiyuan's self-developed high-end AI computing chips with domestically produced CoPoS advanced packaging core technologies.
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